2012 International Conference on Future Optical Materials and Circuit Design

http://www.fomcd-conf.org/index.htm

December 27-28, 2012, Xiamen,China







We are delighted to invite you to participate in 2012 International Conference on Future Optical Materials and Circuit Design (FOMCD 2012) in Xiamen, China, and December 27-28, 2012. The objective of FOMCD 2012 is to provide a forum for researchers, educators, engineers, and government officials involved in the general areas of Environmental and Materials Engineering to disseminate their latest research results and exchange views on the future research directions of these fields.

The FOMCD 2012 conference provides a forum for engineers and scientists in academia, industry, and government to address profound issues including technical challenges, safety, social, legal, political, and economic issues, and to present and discuss their ideas, results, work in progress and experience on all aspects of Optical Materials and Circuit Design .

All accepted papers from FOMCD 2012 will also be published on international journal Advanced Materials Research  and will be indexed in EI Compendex, Thomson ISTP and Elsevier SCOPUSdatabases. (See TTP's Conference List).  Selected excellent papers will be published on international reputation journals:


Advances in Mathematical and Computational Methods [ISSN: 2160-0643]
http://www.ier-institute.org/2160-0643.html

Advances in Mechanical Engineering [ISSN: 2160-0619]
http://www.ier-institute.org/2160-0619.html

Information Engineering Letters [ISSN: 2160-4114]
http://www.ier-institute.org/2163-4114.html





Important datesOctober 30, 2012    Paper submissions due
1-2 weeks after submission    Paper notification of acceptance
November 10, 2012    Camera-ready full papers due
   




The paper format

The submission system is https://www.easychair.org/conferences/?conf=fomcd2012

Contact:
Email:    fomcd2012@163.com
Tel:    +86-18971077945

    Sensors of physical parameters -  Information portal  2016 - 2017                                                                                                            Use of material is possible by placing an active link
SENSORS OF PHYSICAL PARAMETERS